Berkeley Center calls for policy proposals to reboot U.S. tech manufacturing strategy

The newly established TCIP Center is calling for policy study proposals to explore how the U.S. can strengthen its position in advanced technology development, scale-up manufacturing, and supply chain resilience.
The Technology Competitiveness and Industrial Policy Center (TCIP Center), based at the University of California, Berkeley, has issued a call for policy study proposals focused on strengthening U.S. leadership in advanced technology.
The center was founded in February 2025 by Mark Liu, a UC Berkeley alumnus and former executive chairman of Taiwan Semiconductor Manufacturing Company (TSMC).
The initiative is seeking contributions from scholars and researchers to explore how national technology ecosystems can be improved through public policy, industrial capabilities, and economic strategy. Proposals are due by April 30, 2025.
Focus on policy-driven scale-up and supply chain resilience
The Center’s first open call focuses on research topics that span from research and development to scaled manufacturing. Key areas include supply chain reliability, trade policy, regulatory frameworks, market access, and workforce development. Studies are expected to assess how existing U.S. innovation efforts fall short when moving from concept to commercial scale.
S. Shankar Sastry, TCIP Center Faculty Director, said:
“We will need more than the CHIPS & Science Act alone to build a truly robust and comprehensive technology ecosystem. We hope TCIP Center studies will produce actionable recommendations to scale innovation for commercial success and societal prosperity in the United States.”
Policy studies funded by the Center will evaluate current U.S. industrial strategies, the role of taxation, education, and regulation, and the impact of global market dependencies on national security and economic performance. The Center aims to support data-driven policy recommendations that can be implemented at scale.
Interested researchers can learn more and apply here.